Molecular dynamics simulation study of deformation mechanisms in 3C-SiC during nanometric cutting at elevated temperatures (2016)

First Author: Chavoshi S

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1016/j.msea.2015.11.100

Publication URI: http://dx.doi.org/10.1016/j.msea.2015.11.100

Type: Journal Article/Review

Parent Publication: Materials Science and Engineering: A