Heat-to-Connect: Surface Commensurability Directs Organometallic One-Dimensional Self-Assembly (2011)
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.1021/nn203337v
PubMed Identifier: 22003852
Publication URI: http://europepmc.org/abstract/MED/22003852
Type: Journal Article/Review
Parent Publication: ACS Nano
Issue: 11
ISSN: 1936-0851