Compact Electrothermal Reliability Modeling and Experimental Characterization of Bipolar Latchup in SiC and CoolMOS Power MOSFETs (2015)
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.1109/tpel.2015.2388512
Publication URI: http://dx.doi.org/10.1109/tpel.2015.2388512
Type: Journal Article/Review
Parent Publication: IEEE Transactions on Power Electronics
Issue: 12