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Temperature-Dependent Thermal Resistance of GaN-on-Diamond HEMT Wafers (2016)

First Author: Sun H

Attributed to: Novel High Thermal Conductivity Substrates for GaN Electronics: Thermal Innovation funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1109/led.2016.2537835

Publication URI: http://dx.doi.org/10.1109/led.2016.2537835

Type: Journal Article/Review

Parent Publication: IEEE Electron Device Letters

Issue: 5

ISSN: 0741-3106