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Effect of grain size of polycrystalline diamond on its heat spreading properties (2016)

First Author: Simon R

Attributed to: Novel High Thermal Conductivity Substrates for GaN Electronics: Thermal Innovation funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.7567/apex.9.061302

Publication URI: http://dx.doi.org/10.7567/apex.9.061302

Type: Journal Article/Review

Parent Publication: Applied Physics Express

Issue: 6

ISSN: 1882-0778