Effect of grain size of polycrystalline diamond on its heat spreading properties (2016)
Attributed to:
Novel High Thermal Conductivity Substrates for GaN Electronics: Thermal Innovation
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.7567/apex.9.061302
Publication URI: http://dx.doi.org/10.7567/apex.9.061302
Type: Journal Article/Review
Parent Publication: Applied Physics Express
Issue: 6
ISSN: 1882-0778