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Vacuum Packaged Low-Power Resonant MEMS Strain Sensor (2016)

First Author: Do C

Attributed to: Innovation and Knowledge Centre for Smart Infrastructure and Construction - Collaborative Programme Tranche 1 funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1109/jmems.2016.2587867

Publication URI: http://dx.doi.org/10.1109/jmems.2016.2587867

Type: Journal Article/Review

Parent Publication: Journal of Microelectromechanical Systems

Issue: 5