📣 Try out the NEW Gateway to Research and let us know what you think.

We're looking for users to test the new service during August and September and share their feedback. Express your interest by completing this short form.

Predicting Lifetime of Thick Al Wire Bonds Using Signals Obtained From Ultrasonic Generator (2016)

First Author: Arjmand E

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1109/tcpmt.2016.2543001

Publication URI: http://dx.doi.org/10.1109/tcpmt.2016.2543001

Type: Journal Article/Review

Parent Publication: IEEE Transactions on Components, Packaging and Manufacturing Technology

Issue: 5