Experimental Investigation on the Effects of Narrow Junction Temperature Cycles on Die-Attach Solder Layer in an IGBT Module (2017)
Attributed to:
Underpinning Power Electronics 2012: Devices Theme
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.1109/tpel.2016.2546944
Publication URI: http://dx.doi.org/10.1109/tpel.2016.2546944
Type: Journal Article/Review
Parent Publication: IEEE Transactions on Power Electronics
Issue: 2