High-temperature (>500°c) wall thickness monitoring using dry-coupled ultrasonic waveguide transducers. (2011)

First Author: Cegla FB

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1109/tuffc.2011.1782

PubMed Identifier: 21244983

Publication URI: http://europepmc.org/abstract/MED/21244983

Type: Journal Article/Review

Volume: 58

Parent Publication: IEEE transactions on ultrasonics, ferroelectrics, and frequency control

Issue: 1

ISSN: 0885-3010