Microstructure and electrical properties of co-sputtered Cu embedded amorphous SiC (2016)

First Author: Fan J

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1016/j.matlet.2016.04.144

Publication URI: http://dx.doi.org/10.1016/j.matlet.2016.04.144

Type: Journal Article/Review

Parent Publication: Materials Letters