Ceramic filled resin based 3D printed X -band dual-mode bandpass filter with enhanced thermal handling capability (2016)
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.1049/el.2016.2955
Publication URI: http://dx.doi.org/10.1049/el.2016.2955
Type: Journal Article/Review
Parent Publication: Electronics Letters
Issue: 23