In-Service Diagnostics for Wire-Bond Lift-off and Solder Fatigue of Power Semiconductor Packages (2017)
Attributed to:
Transformation of the Top and Tail of Energy Networks
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.1109/tpel.2016.2628705
Publication URI: http://dx.doi.org/10.1109/tpel.2016.2628705
Type: Journal Article/Review
Parent Publication: IEEE Transactions on Power Electronics
Issue: 9