A highly compact packaging concept for ultrasound transducer arrays embedded in neurosurgical needles (2016)
Attributed to:
Confidence in Concept CMVM University of Edinburgh Edinburgh Partners in Translation (EPiT)
funded by
MRC
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.1007/s00542-015-2775-1
Publication URI: http://dx.doi.org/10.1007/s00542-015-2775-1
Type: Journal Article/Review
Parent Publication: Microsystem Technologies
Issue: 9