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A highly compact packaging concept for ultrasound transducer arrays embedded in neurosurgical needles (2016)

First Author: Schiavone G

Attributed to: Confidence in Concept CMVM University of Edinburgh Edinburgh Partners in Translation (EPiT) funded by MRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1007/s00542-015-2775-1

Publication URI: http://dx.doi.org/10.1007/s00542-015-2775-1

Type: Journal Article/Review

Parent Publication: Microsystem Technologies

Issue: 9