Development and characterisation of pressed packaging solutions for high-temperature high-reliability SiC power modules (2016)
Attributed to:
Underpinning Power Electronics 2012: Hub
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.1016/j.microrel.2016.07.062
Publication URI: http://dx.doi.org/10.1016/j.microrel.2016.07.062
Type: Journal Article/Review
Parent Publication: Microelectronics Reliability
ISSN: 0026-2714