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Evaluation of the impact of the physical dimensions and material of the semiconductor chip on the reliability of Sn3.5Ag solder interconnect in power electronic module: A finite element analysis perspective (2017)

First Author: Rajaguru P

Attributed to: Underpinning Power Electronics 2012: Hub funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1016/j.microrel.2016.12.002

Publication URI: http://dx.doi.org/10.1016/j.microrel.2016.12.002

Type: Journal Article/Review

Parent Publication: Microelectronics Reliability

ISSN: 0026-2714