Evaluation of the impact of the physical dimensions and material of the semiconductor chip on the reliability of Sn3.5Ag solder interconnect in power electronic module: A finite element analysis perspective (2017)
Attributed to:
Underpinning Power Electronics 2012: Hub
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.1016/j.microrel.2016.12.002
Publication URI: http://dx.doi.org/10.1016/j.microrel.2016.12.002
Type: Journal Article/Review
Parent Publication: Microelectronics Reliability
ISSN: 0026-2714