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Micro-mechanical and fracture characteristics of Cu 6 Sn 5 and Cu 3 Sn intermetallic compounds under micro-cantilever bending (2016)

First Author: Liu L

Attributed to: Underpinning Power Electronics 2012: Hub funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1016/j.intermet.2016.06.004

Publication URI: http://dx.doi.org/10.1016/j.intermet.2016.06.004

Type: Journal Article/Review

Parent Publication: Intermetallics