Micro-mechanical and fracture characteristics of Cu 6 Sn 5 and Cu 3 Sn intermetallic compounds under micro-cantilever bending (2016)
Attributed to:
Underpinning Power Electronics 2012: Hub
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.1016/j.intermet.2016.06.004
Publication URI: http://dx.doi.org/10.1016/j.intermet.2016.06.004
Type: Journal Article/Review
Parent Publication: Intermetallics