Perpendicular Growth Characteristics of Cu-Sn Intermetallic Compounds at the Surface of 99Sn-1Cu/Cu Solder Interconnects (2015)

First Author: Chen Z
Attributed to:  Underpinning Power Electronics 2012: Hub funded by EPSRC


No abstract provided

Bibliographic Information

Digital Object Identifier:

Publication URI:

Type: Journal Article/Review

Parent Publication: Journal of Electronic Materials

Issue: 12