Perpendicular Growth Characteristics of Cu-Sn Intermetallic Compounds at the Surface of 99Sn-1Cu/Cu Solder Interconnects (2015)

First Author: Chen Z

Attributed to: Underpinning Power Electronics 2012: Hub funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1007/s11664-015-4043-7

Publication URI: http://dx.doi.org/10.1007/s11664-015-4043-7

Type: Journal Article/Review

Parent Publication: Journal of Electronic Materials

Issue: 12