Perpendicular Growth Characteristics of Cu-Sn Intermetallic Compounds at the Surface of 99Sn-1Cu/Cu Solder Interconnects (2015)
Attributed to:
Underpinning Power Electronics 2012: Hub
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.1007/s11664-015-4043-7
Publication URI: http://dx.doi.org/10.1007/s11664-015-4043-7
Type: Journal Article/Review
Parent Publication: Journal of Electronic Materials
Issue: 12