Microstructural and mechanical analysis on Cu-Sn intermetallic micro-joints under isothermal condition (2015)
Attributed to:
Underpinning Power Electronics 2012: Hub
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.1016/j.intermet.2015.06.019
Publication URI: http://dx.doi.org/10.1016/j.intermet.2015.06.019
Type: Journal Article/Review
Parent Publication: Intermetallics