A MEMS thermal shear stress sensor produced by a combination of substrate-free structures with anodic bonding technology (2016)

First Author: Ou Y
Attributed to:  The Centre for Advanced Tribology at Southampton funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1063/1.4958842

Publication URI: http://dx.doi.org/10.1063/1.4958842

Type: Journal Article/Review

Parent Publication: Applied Physics Letters

Issue: 2