A Multiphysics Modeling and Experimental Analysis of Pressure Contacts in Power Electronics Applications (2017)
Attributed to:
Underpinning Power Electronics 2012: Hub
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.1109/tcpmt.2017.2688021
Publication URI: http://dx.doi.org/10.1109/tcpmt.2017.2688021
Type: Journal Article/Review
Parent Publication: IEEE Transactions on Components, Packaging and Manufacturing Technology
Issue: 6