Bending induced electrical response variations in ultra-thin flexible chips and device modeling (2017)
Attributed to:
FLEXIBLE ELECTRONIC DEVICE MODELLING
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.1063/1.4991532
Publication URI: http://dx.doi.org/10.1063/1.4991532
Type: Journal Article/Review
Parent Publication: Applied Physics Reviews
Issue: 3