Bending induced electrical response variations in ultra-thin flexible chips and device modeling (2017)

First Author: Heidari H

Attributed to: FLEXIBLE ELECTRONIC DEVICE MODELLING funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1063/1.4991532

Publication URI: http://dx.doi.org/10.1063/1.4991532

Type: Journal Article/Review

Parent Publication: Applied Physics Reviews

Issue: 3