Use of Supramolecular Assemblies as Lithographic Resists. (2017)

First Author: Lewis SM
Attributed to:  A modular approach to multi-component molecular assemblies funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1002/anie.201700224

PubMed Identifier: 28504420

Publication URI: http://europepmc.org/abstract/MED/28504420

Type: Journal Article/Review

Volume: 56

Parent Publication: Angewandte Chemie (International ed. in English)

Issue: 24

ISSN: 1433-7851