Wavelet analysis to decompose a vibration simulation signal to improve pre-distribution testing of packaging (2016)
Attributed to:
Engineering Innovative Manufacturing Research Centre Renewal
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.1016/j.ymssp.2015.12.035
Publication URI: http://dx.doi.org/10.1016/j.ymssp.2015.12.035
Type: Journal Article/Review
Parent Publication: Mechanical Systems and Signal Processing
ISSN: 0888-3270