Cu6Sn5 crystal growth mechanisms during solidification of electronic interconnections (2017)
Attributed to:
Engineering Fellowships for Growth: Solidification Processing of Alloys for Sustainable Manufacturing
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.1016/j.actamat.2016.12.043
Publication URI: http://dx.doi.org/10.1016/j.actamat.2016.12.043
Type: Journal Article/Review
Parent Publication: Acta Materialia