Nucleation, grain orientations, and microstructure of Sn-3Ag-0.5Cu soldered on cobalt substrates (2017)

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1016/j.jallcom.2017.02.243

Publication URI: http://dx.doi.org/10.1016/j.jallcom.2017.02.243

Type: Journal Article/Review

Parent Publication: Journal of Alloys and Compounds