Stress Analysis and Optimization of a Flip Chip on Flex Electronic Packaging Method for Functional Electronic Textiles (2018)

First Author: Li M
Attributed to:  Novel manufacturing methods for functional electronic textiles funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1109/tcpmt.2017.2780626

Publication URI: http://dx.doi.org/10.1109/tcpmt.2017.2780626

Type: Journal Article/Review

Parent Publication: IEEE Transactions on Components, Packaging and Manufacturing Technology

Issue: 2