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Pressure contact multi-chip packaging of SiC Schottky diodes (2017)

First Author: Gonzalez J

Attributed to: Underpinning Power Electronics 2012: Components Theme funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.23919/ispsd.2017.7988977

Publication URI: http://dx.doi.org/10.23919/ispsd.2017.7988977

Type: Conference/Paper/Proceeding/Abstract