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Development and characterisation of pressed packaging solutions for high-temperature high-reliability SiC power modules (2016)

First Author: Ortiz Gonzalez J

Attributed to: Underpinning Power Electronics 2012: Components Theme funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1016/j.microrel.2016.07.062

Publication URI: http://dx.doi.org/10.1016/j.microrel.2016.07.062

Type: Journal Article/Review

Parent Publication: Microelectronics Reliability