A Multiphysics Modeling and Experimental Analysis of Pressure Contacts in Power Electronics Applications (2017)

First Author: Rajaguru P
Attributed to:  Underpinning Power Electronics 2012: Components Theme funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1109/tcpmt.2017.2688021

Publication URI: http://dx.doi.org/10.1109/tcpmt.2017.2688021

Type: Journal Article/Review

Parent Publication: IEEE Transactions on Components, Packaging and Manufacturing Technology

Issue: 6