Failure and Reliability Analysis of a SiC Power Module Based on Stress Comparison to a Si Device (2017)
Attributed to:
Underpinning Power Electronics 2012: Components Theme
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.1109/tdmr.2017.2766692
Publication URI: http://dx.doi.org/10.1109/tdmr.2017.2766692
Type: Journal Article/Review
Parent Publication: IEEE Transactions on Device and Materials Reliability
Issue: 4