Improved Reliability of Planar Power Interconnect With Ceramic-Based Structure (2018)

First Author: Zhang H
Attributed to:  Underpinning Power Electronics 2012: Components Theme funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1109/jestpe.2017.2758901

Publication URI: http://dx.doi.org/10.1109/jestpe.2017.2758901

Type: Journal Article/Review

Parent Publication: IEEE Journal of Emerging and Selected Topics in Power Electronics

Issue: 1