Stress Analysis of Flexible Packaging for the Integration of Electronic Components within Woven Textiles (2017)

First Author: Li M
Attributed to:  Novel manufacturing methods for functional electronic textiles funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1109/ectc.2017.23

Publication URI: http://dx.doi.org/10.1109/ectc.2017.23

Type: Conference/Paper/Proceeding/Abstract