Highly Stable Plasmon Induced Hot Hole Transfer into Silicon via a SrTiO 3 Passivation Interface (2018)

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1002/adfm.201705829

Publication URI: http://dx.doi.org/10.1002/adfm.201705829

Type: Journal Article/Review

Parent Publication: Advanced Functional Materials

Issue: 17