Improved Reliability of Planar Power Interconnect With Ceramic-Based Structure (2018)
Attributed to:
Underpinning Power Electronics 2012: Hub
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.1109/jestpe.2017.2758901
Publication URI: http://dx.doi.org/10.1109/jestpe.2017.2758901
Type: Journal Article/Review
Parent Publication: IEEE Journal of Emerging and Selected Topics in Power Electronics
Issue: 1