Competition between stable and metastable eutectic growth in Sn-Ni alloys (2018)
Attributed to:
High Reliability Interconnects: New Methodologies for Lead-free Solders
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.1016/j.actamat.2018.02.034
Publication URI: http://dx.doi.org/10.1016/j.actamat.2018.02.034
Type: Journal Article/Review
Parent Publication: Acta Materialia