📣 Help Shape the Future of UKRI's Gateway to Research (GtR)

We're improving UKRI's Gateway to Research and are seeking your input! If you would be interested in being interviewed about the improvements we're making and to have your say about how we can make GtR more user-friendly, impactful, and effective for the Research and Innovation community, please email gateway@ukri.org.

Wafer Scale Transfer of Ultrathin Silicon Chips on Flexible Substrates for High Performance Bendable Systems (2018)

First Author: Navaraj W

Attributed to: FLEXIBLE ELECTRONIC DEVICE MODELLING funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1002/aelm.201700277

Publication URI: http://dx.doi.org/10.1002/aelm.201700277

Type: Journal Article/Review

Parent Publication: Advanced Electronic Materials

Issue: 4