Wafer Scale Transfer of Ultrathin Silicon Chips on Flexible Substrates for High Performance Bendable Systems (2018)

First Author: Navaraj W

Attributed to: FLEXIBLE ELECTRONIC DEVICE MODELLING funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1002/aelm.201700277

Publication URI: http://dx.doi.org/10.1002/aelm.201700277

Type: Journal Article/Review

Parent Publication: Advanced Electronic Materials

Issue: 4