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Nucleation of tin on the Cu6Sn5 layer in electronic interconnections (2017)

First Author: Xian J

Attributed to: Future Liquid Metal Engineering Hub funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1016/j.actamat.2016.10.008

Publication URI: http://dx.doi.org/10.1016/j.actamat.2016.10.008

Type: Journal Article/Review

Parent Publication: Acta Materialia