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Innovative 3C-SiC on SiC via Direct Wafer Bonding (2013)

First Author: Jennings M

Attributed to: Vehicle Electrical Systems Integration (VESI) funded by UKRI

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.4028/www.scientific.net/msf.740-742.271

Publication URI: http://dx.doi.org/10.4028/www.scientific.net/msf.740-742.271

Type: Journal Article/Review

Parent Publication: Materials Science Forum