Thick-film Acoustic emission sensors for use in structurally integrated condition-monitoring applications (2008)

First Author: Pickwell A.J.

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1109/tuffo.2011.2043

Publication URI: http://dx.doi.org/10.1109/tuffo.2011.2043

Type: Journal Article/Review

Volume: 36

Parent Publication: IEEE Transactions on Plasma Science

Issue: 5

ISSN: 00933813