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Experimental Investigation on the Effects of Narrow Junction Temperature Cycles on Die-Attach Solder Layer in an IGBT Module (2017)

First Author: Lai W

Attributed to: High Current Module and Technologies Optimised for HVDC funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1109/tpel.2016.2546944

Publication URI: http://dx.doi.org/10.1109/tpel.2016.2546944

Type: Journal Article/Review

Parent Publication: IEEE Transactions on Power Electronics

Issue: 2

ISSN: 08858993