Experimental Investigation on the Effects of Narrow Junction Temperature Cycles on Die-Attach Solder Layer in an IGBT Module (2017)

First Author: Lai W
Attributed to:  High Current Module and Technologies Optimised for HVDC funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1109/tpel.2016.2546944

Publication URI: http://dx.doi.org/10.1109/tpel.2016.2546944

Type: Journal Article/Review

Parent Publication: IEEE Transactions on Power Electronics

Issue: 2

ISSN: 08858993