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Impact of temperature imbalance on junction temperature identification for multiple chip modules using TSEPs (2017)

First Author: Gonzalez J.O.

Attributed to: High Current Module and Technologies Optimised for HVDC funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1109/sbmicro.2017.7990732

Publication URI: http://dx.doi.org/10.1109/sbmicro.2017.7990732

Type: Other

Parent Publication: PCIM Europe 2017 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management