Out-of-plane heat transfer in van der Waals stacks through electron-hyperbolic phonon coupling. (2018)
Attributed to:
Engineering van der Waals heterostructures: from atomic level layer-by-layer assembly to printable innovative devices
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.1038/s41565-017-0008-8
PubMed Identifier: 29180742
Publication URI: http://europepmc.org/abstract/MED/29180742
Type: Journal Article/Review
Volume: 13
Parent Publication: Nature nanotechnology
Issue: 1
ISSN: 1748-3387