Comparative Thermal and Structural Characterization of Sintered Nano-Silver and High-Lead Solder Die Attachments During Power Cycling (2018)
Attributed to:
University of Nottingham - Equipment Account
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.1109/tdmr.2018.2825386
Publication URI: http://dx.doi.org/10.1109/tdmr.2018.2825386
Type: Journal Article/Review
Parent Publication: IEEE Transactions on Device and Materials Reliability
Issue: 2