Comparative Thermal and Structural Characterization of Sintered Nano-Silver and High-Lead Solder Die Attachments During Power Cycling (2018)

First Author: Dai J

Attributed to: Underpinning Power Electronics 2012: Hub funded by EPSRC

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1109/tdmr.2018.2825386

Publication URI: http://dx.doi.org/10.1109/tdmr.2018.2825386

Type: Journal Article/Review

Parent Publication: IEEE Transactions on Device and Materials Reliability

Issue: 2