Low-Temperature Wafer-Scale Deposition of Continuous 2D SnS2 Films. (2018)
Attributed to:
Donor Design for Maximum Mobility TCOs
funded by
EPSRC
Abstract
No abstract provided
Bibliographic Information
Digital Object Identifier: http://dx.doi.org/10.1002/smll.201800547
PubMed Identifier: 29673074
Publication URI: http://europepmc.org/abstract/MED/29673074
Type: Journal Article/Review
Volume: 14
Parent Publication: Small (Weinheim an der Bergstrasse, Germany)
Issue: 21
ISSN: 1613-6810