Mechanisms of beta-Sn nucleation and microstructure evolution in Sn-Ag-Cu solders containing titanium (2019)

Abstract

No abstract provided

Bibliographic Information

Digital Object Identifier: http://dx.doi.org/10.1016/j.jallcom.2018.11.097

Publication URI: http://dx.doi.org/10.1016/j.jallcom.2018.11.097

Type: Journal Article/Review

Parent Publication: Journal of Alloys and Compounds